Laser systems continue to gain ground in material processing applications that are demanding innovative technologies that provide high speed, quality and flexibility to reduce manufacturing costs. Microelectronics manufacturing which include semiconductor, printed circuit boards (PCBs), and IC wafers are a few applications which use laser technology over traditional methods.
Many companies produce lasers for microelectronics and semiconductor manufacturing for micro laser welding, laser cutting and laser marking combined with cutting edge technology.
Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuit boards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processed with lasers. Some of these operations, such as microtia drilling in high-density circuit boards, are well established; others are under evaluation or in early stages of development.
The size of semiconductor dies and packaged devices continues to shrink in order to support more sophisticated and compact tablets, phones, watches and other wearables. This trend creates greater opportunities for lasers because of their unique ability to perform diverse materials processing tasks with high precision and minimal heat‐affected zone (HAZ).
As a result, lasers are finding increased use in wafer dicing, package singulation, optical debonding, micro‐via drilling, RDL (re‐distribution layer) structuring, dicing tape cutting (EMI shield), soldering, annealing and laser‐assisted bonding.